Lihlahisoa tsa rona
Borosilicate Glass Disc/ Borosilicate Glass Plate/ Pyrex Glass Sheet bakeng sa Printer ea 3D
Borosilicate Glass Disc/ Borosilicate Glass Plate/ Pyrex Glass Sheet bakeng sa Printer ea 3D
Tlhaloso ea Tlhahiso:
fensetere ea khalase ea borosilicate e hlakileng / retangle khalase ea borosilicate fensetere / fensetere ea khalase ea borosilicate
Borosilicate khalase 3.3 ke e 'ngoe ea likhalase tse bonaletsang tse se nang 'mala, ka bolelele ba maqhubu a pakeng tsa 300 nm ho isa ho 2500 nm, transmissivity e feta 90%. Coefficient ea katoloso ea mocheso ke 3.3. E khona ho fana ka bopaki ba asiti le alkali, mocheso o phahameng o hanyetsanang le 450 ° C. Haeba e sebetsa, mocheso o phahameng o hanyetsanang le mocheso o ka fihla ho 550 ° C kapa ho feta. Etsa kopo ho lisebelisoa tsa mabone, indasteri ea lik'hemik'hale, elektronike, lisebelisoa tsa mocheso o phahameng joalo-joalo.
Khalase ea Borosilicate 3.3 e na le phetisetso e babatsehang holim'a maqhubu a bonahalang le a NIR a sebetsang ho tloha 310nm ho ea 2700nm. Boleng ba bokaholimo ha bo holimo joalo ka liphetolelo tsa BK7.
Khalase ea Borosilicate 3.3 e na le lik'hemik'hale tse ntle haholo le ho hanyetsa mocheso 'me e na le boholo
mocheso o sebetsang oa 500 ° C kahoo li ntle haholo bakeng sa ho sebelisoa lits'ebetsong tse phahameng tsa mohloli oa leseli kapa
khetho e babatsehang bakeng sa li-substrates tse batang le tse chesang tsa seipone.
| Densityρ: | 2.23± 0.02g/cm3 |
| Ho thatafala: | >7 |
| Matla a tšepe: | 4.8×107Pa(N/M2) |
| Modulus ea bongata: | 93×103 M pa |
| Modulus ea rigidity: | 3.1×1010Pa |
| Module oa Young: | 63KN/mm3 |
| Matla a hatellang: | 1200kg/cm2 |
| Karo-karolelano ea Poisson: | 0.18 |
| Coefficient ea ho eketsa mocheso: | (0-300℃) (3.3±0.1)x10-6K-1 |
| Coefficient of thermal conductivity: | 1.2W×(m×k) -1 |
| Mocheso o khethehileng: | (20-100℃) 00.82kJx(kgxk) |
| Ts'ebetso ea Optical: | |
| 1. Phetiso ea leseli: | 92% |
| 2. Lenane la refractive: | Nd: 1,47384 |
| 3. Bolelele ba maqhubu: | 435.8nm=1.481, 479.9nm=1.4772 , 546.1nm=1.4732 |
| Sebaka sa ho nolofatsa: | 810±10 ℃ |
| The resistivity1gρ | 250℃ 8.0Ω×cm |
| Dielectric coefficiente | 4.7 |
| Matla a dielectric | 5 ×107V/M |
| Ntho ea tahlehelo ea dielectric | tanσ(MC20℃)≤38 ×10-4 |
| Ho hanyetsa serame le mocheso o chesang | 280 ℃ |
| Mocheso o tsoelang pele oa ho sebetsa | ≤550 ℃ |
fensetere ea khalase ea borosilicate e hlakileng / retangle khalase ea borosilicate fensetere / fensetere ea khalase ea borosilicate
kopo ea khalase ea borosilicate:
Substrates bakeng sa ho roala dielectric
Lisebelisoa tsa mabone
Li-substrates tsa optical filter coating
Li-substrates tsa Wafer
Likopo tsa bonding tsa anodic
Biotechnology
Photovoltaics
Theknoloji ea tikoloho
Libaka tse thata
Li-absorber tsa nyutrone
Tekanyo le theknoloji ea sensor
Lintlha tsa Sephutheloana:
Ka kopo, ikutloe u lokolohile ho ikopanya le 'na haeba u na le lipotso tse ling
Lintlha tsa Sephutheloana:
TLHOKOMELO E TLOANG
Boleng ba Pele, Tšireletseho e Tiisitsoe
