3D Mea Paʻi Paʻi UM2 Borosilicate Glass Plate Me 257 * 229 * 4mm no Ultimaker 2 3d paʻi.
ʻO kā mākou pono:
1.High maikaʻi
2. Hoʻopili pono ʻia i loko o nā pahu lāʻau e pale i nā pohō i ka wā o ka lawe ʻana
3.Customize i ka nui āu e pono ai.
ʻO ka pā aniani me ka moe hoʻomehana alumini MK3
PCB wela me ka papa aniani
Ke aniani Borosilicate 3.3 ʻO ia kekahi o ke aniani kala ʻole, ma waena o 300 nm a 2500 nm ka lōʻihi nalu, ʻoi aku ka transmissivity ma mua o 90%. ʻO ka helu o ka hoʻonui wela he 3.3. Hiki iā ia ke hōʻoia i ka waikawa a me ka alkali, ʻo ke kiʻekiʻe kiʻekiʻe e kū nei ma kahi o 450 ° C. Inā mālama ʻia ka papa, hiki ke kū i ka wela kiʻekiʻe i 550°C a i ʻole. E noi i nā kukui uila, ʻoihana kemika, electron, nā mea wela kiʻekiʻe a pēlā aku.
ʻO ke aniani Borosilicate 3.3 he hoʻouna maikaʻi loa ma luna o nā nalu ʻike a NIR e hana ana mai 310nm a 2700nm. ʻAʻole kiʻekiʻe ka maikaʻi o ka ʻili e like me nā mana BK7.
ʻO ke aniani ʻo Borosilicate 3.3 he kemika maikaʻi loa a me ka thermal-shock resistance a loaʻa ka mahana hana kiʻekiʻe loa o 500 ° C no laila maikaʻi loa no ka hoʻohana ʻana i nā noi kumu kukui mana kiʻekiʻe a i ʻole kahi koho maikaʻi loa no ke anu a me ka wela. nā pani aniani ..
inoa mea kūʻai
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aniani borosilicate
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ʻAiʻa:
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2.23± 0.02g/cm3
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ʻoʻoleʻa
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>7
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Ka ikaika tensile
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4.8×107Pa(N/M2)
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Modulus nui
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93×103 M pa
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Modulus o ka rigidity
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3.1×1010Pa
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Ka modulus opio
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63KN/mm3
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Ka ikaika compressive
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1200kg/cm2
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Lakiō o Poisson
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0.18
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Koefisi hoonui wela
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(0-300 ℃) (3.3±0.1)x10-6K-1
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Coefficient o ka thermal conductivity
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1.2W×(m×k) -1
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Kaha wela kūikawā
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(20-100 ℃) 00.82kJx(kgxk)
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Lae palupalu
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810±10 ℃
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ʻO ka pale ʻana1gρ
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250 ℃ 8.0Ω×cm
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Koefisi dielectricε
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4.7
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Ka ikaika dielectric
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5 ×107V/M
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Dielectric poho kumu
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tanσ(MC20 ℃)≤38 ×10-4
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Kū'ē i ke anu a me ka haʻalulu wela
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280 ℃
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Ka wela hana mau
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≤550 ℃
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Māmā māmā
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92%
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ʻO ka helu hoʻopaʻapaʻa
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1.47384
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Ka lōʻihi nalu
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435.8nm=1.481, 479.9nm=1.4772, 546.1nm=1.4732
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Pono mua, palekana palekana