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3D Mea Paʻi Paʻi Pāpaʻi aniani Borosilicate no ka nui paʻi 3d 257 * 229 * 4mm no ka mea paʻi UM2

ʻO ka wehewehe pōkole:


  • Kūkākūkā uku: L/C, D/A, D/P, T/T
  • ʻAno: Paʻi aniani 3d
  • kala: akaka
  • mānoanoa: 4mm
  • Nui: hoʻopilikino
  • Huahana Huahana

    Huahana Huahana

    3D Mea Paʻi Paʻi UM2 Borosilicate Glass Plate Me 257 * 229 * 4mm no Ultimaker 2 3d paʻi.

    ʻO kā mākou pono:

    1.High maikaʻi

    2. Hoʻopili pono ʻia i loko o nā pahu lāʻau e pale i nā pohō i ka wā o ka lawe ʻana

    3.Customize i ka nui āu e pono ai.

    ʻO ka pā aniani me ka moe hoʻomehana alumini MK3

    PCB wela me ka papa aniani

    3D Printer Parts  Borosilicate glass Plate for 3d printing size  257*229*4mm for UM2 printer

    3D Printer Parts  Borosilicate glass Plate for 3d printing size  257*229*4mm for UM2 printer

    3D Printer Parts  Borosilicate glass Plate for 3d printing size  257*229*4mm for UM2 printer

    Ke aniani Borosilicate 3.3 ʻO ia kekahi o ke aniani kala ʻole, ma waena o 300 nm a 2500 nm ka lōʻihi nalu, ʻoi aku ka transmissivity ma mua o 90%. ʻO ka helu o ka hoʻonui wela he 3.3. Hiki iā ia ke hōʻoia i ka waikawa a me ka alkali, ʻo ke kiʻekiʻe kiʻekiʻe e kū nei ma kahi o 450 ° C. Inā mālama ʻia ka papa, hiki ke kū i ka wela kiʻekiʻe i 550°C a i ʻole. E noi i nā kukui uila, ʻoihana kemika, electron, nā mea wela kiʻekiʻe a pēlā aku.
    ʻO ke aniani Borosilicate 3.3 he hoʻouna maikaʻi loa ma luna o nā nalu ʻike a NIR e hana ana mai 310nm a 2700nm. ʻAʻole kiʻekiʻe ka maikaʻi o ka ʻili e like me nā mana BK7.
    ʻO ke aniani ʻo Borosilicate 3.3 he kemika maikaʻi loa a me ka thermal-shock resistance a loaʻa ka mahana hana kiʻekiʻe loa o 500 ° C no laila maikaʻi loa no ka hoʻohana ʻana i nā noi kumu kukui mana kiʻekiʻe a i ʻole kahi koho maikaʻi loa no ke anu a me ka wela. 
    nā pani aniani ..

    ʻO ke aniani borosilicate 3.3 kikoʻī

    inoa mea kūʻai
    aniani borosilicate
    ʻAiʻa:
    2.23± 0.02g/cm3
    ʻoʻoleʻa
    >7
    Ka ikaika tensile
    4.8×107Pa(N/M2)
    Modulus nui
    93×103 M pa
    Modulus o ka rigidity
     3.1×1010Pa
    Ka modulus opio
    63KN/mm3
    Ka ikaika compressive
    1200kg/cm2
    Lakiō o Poisson
    0.18
    Koefisi hoonui wela
    (0-300 ℃) (3.3±0.1)x10-6K-1
    Coefficient o ka thermal conductivity
    1.2W×(m×k) -1
    Kaha wela kūikawā
    (20-100 ℃) 00.82kJx(kgxk)
    Lae palupalu
    810±10 ℃
    ʻO ka pale ʻana1gρ
    250 ℃ 8.0Ω×cm
    Koefisi dielectricε
    4.7
    Ka ikaika dielectric
    5 ×107V/M
    Dielectric poho kumu
    tanσ(MC20 ℃)≤38 ×10-4
    Kū'ē i ke anu a me ka haʻalulu wela
    280 ℃
    Ka wela hana mau
    ≤550 ℃

    Optical hana o ke aniani borosilicate

    Māmā māmā
     92%
    ʻO ka helu hoʻopaʻapaʻa
    1.47384
    Ka lōʻihi nalu
    435.8nm=1.481, 479.9nm=1.4772, 546.1nm=1.4732

    Ke noi aniani borosilicate

    Nā mea hana hoʻokolohua
    ʻoihana kemika
    Puke meaʻai
    Puke lapaʻau
    ʻO nā substrate no nā uhi dielectric
    Nā noi kukui
    ʻO nā substrate kānana kānana
    ʻO nā substrate wafer
    Nā noi hoʻopaʻa anodic
    Biotechnology
    Photovoltaics
    ʻenehana kaiapuni
    Kaiapuni paakiki
    Nā mea hoʻopale neutron
    Ke ana a me ka ike loea
    ʻO ke aniani ʻike a me ke aniani ʻike
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