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Borosilicate Glass Disc/ Borosilicate Glass Plate/ Pyrex Glass Sheet for 3D Printer
Borosilicate Glass Disc/ Borosilicate Glass Plate/ Pyrex Glass Sheet for 3D Printer
Production Describtion:
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Borosilicate glass 3.3 is one of transparent colorless glass, through wavelength is between 300 nm to 2500 nm, transmissivity is more than 90%. Coefficient of thermal expansion is 3.3. It can acid proof and alkali , the high temperature resistant is about 450°C. If course handling , the high temperature resistant can reach 550°C or so. Apply to lighting fixture , chemical industry , electron, high temperature equipment and so on.
Borosilicate glass 3.3 has excellent transmission over the visible and NIR wavelengths working from 310nm to 2700nm. The surface quality is not as high as the BK7 versions.
Borosilicate glass 3.3 has excellent chemical and thermalshock resistance and has a maximum
working temperature of 500°C so are excellent for use in high powered light source applications or
an excellent choice for cold and hot mirror substrates.
| Densityρ: | 2.23± 0.02g/cm3 |
| Hardness: | >7 |
| Tensile strength: | 4.8×107Pa(N/M2) |
| Bulk modulus: | 93×103 M pa |
| Modulus of rigidity: | 3.1×1010Pa |
| Young’s modulus: | 63KN/mm3 |
| Compressive strength: | 1200kg/ cm2 |
| Poisson’s ratio: | 0.18 |
| Thermal expansion coefficient: | (0-300℃) (3.3±0.1)x10-6K-1 |
| Coefficient of thermal conductivity: | 1.2W×(m×k) -1 |
| Specific heat capacity: | (20-100℃) 00.82kJx(kgxk) |
| Optical performance: | |
| 1. Light transmittance: | 92% |
| 2. The refractive index: | Nd: 1.47384 |
| 3. The wavelength: | 435.8nm=1.481, 479.9nm=1.4772 , 546.1nm=1.4732 |
| Softening point: | 810±10 ℃ |
| The resistivity1gρ | 250℃ 8.0Ω×cm |
| Dielectric coefficientε | 4.7 |
| Dielectric strength | 5 ×107V/M |
| Dielectric loss factor | tanσ(MC20℃)≤38 ×10-4 |
| Resistance to cold and hot shock | 280℃ |
| Continuous working temperature | ≤550℃ |
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borosilicate glass application:
Substrates for dielectric coatings
Lighting applications
Optical filter coating substrates
Wafer substrates
Anodic bonding applications
Biotechnology
Photovoltaics
Environmental technology
Harsh environments
Neutron absorbers
Measurement and sensor technology
Package Details:
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Package Details:
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